A 3D self-shaping strategy is developed by Fengyu Li, Yanlin Song, and co-workers in article number 1703963 to fabricate nanoresolution multicomponent 3D architectures. The as-prepared 3D circuits assembled by silver nanoparticles carry a current of 208–448 μA at an impressed voltage of 0.01 V, while the 3D architectures achieved by two different quantum dots show non-interfering optical properties with feature resolution below 3 μm. The new strategy for fabrication of micro–nano geometric patterns without a modeling program will promote the development of functional 3D devices.
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