Micromachines, Vol. 7, Pages 105: Fabrication of Dish-Shaped Micro Parts by Laser Indirect Shocking Compound Process

Compound process technology has been investigated for many years on a macro scale, but only a few studies can be found on a micro scale due to the difficulties in tool manufacturing, parts transporting and punch-die alignment. In this paper, a novel technology of combining the laser shock wave and soft punch was introduced to fabricate the dish-shaped micro-parts on copper to solve these difficulties. This compound process includes deep drawing, punching and blanking and these processes can be completed almost at the same time because the duration time of laser is quite short, so the precision of the micro-parts can be ensured. A reasonable laser energy of 1550 mJ made the morphology, depth of deformation, dimensional accuracy and surface roughness achieve their best results when the thickness of the soft punches was 200 μm. In addition, thicker soft punches may hinder the compound process due to the action of unloading waves based on the elastic wave theory. So, the greatest thickness of the soft punches was 200 μm.

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